In recent years, global artificial intelligence technology has accelerated innovation, and the strong demand for AI servers and high-frequency high-speed communication network systems has driven the demand for large-sized, high multi-layer PCBs and high-frequency high-speed copper-clad laminates (CCL). The market’s performance requirements for electronic yarns have also increased, and the demand for high-end products such as low dielectric, low expansion, and high strength continues to grow.
AI drives the upgrade of electronic yarn. Electronic yarn, also known as electronic grade glass fiber yarn, is a type of ultra high purity and high-performance glass fiber yarn manufactured through special formulas and precision processes. It is the core raw material for producing electronic fabric, accounting for about 50% -60% of the cost of electronic fabric. Electronic fabric, copper foil, and synthetic resin together form copper-clad laminate (CCL), which is an important basic material for printed circuit boards (PCBs).
Low dielectric glass fiber plays an important role in high-frequency and high-speed signal transmission, effectively reducing attenuation and distortion during signal transmission. It is the core substrate material for PCBs used in high-end electronic devices such as 5G base stations, AI servers, and data center switches.
Low expansion fiberglass is mainly used in the field of advanced chip packaging, which can effectively solve the heat dissipation and packaging stability problems after chip stacking, ensure the reliable operation of chips in complex working environments, and meet the requirements of high-end chip packaging carrier boards.

At present, material upgrades are still ongoing. Based on the Low Dk first and second generation materials, quartz fiber cloth (Q cloth) Dk 3.74 and Df 0.0002 at 10GHz has been tested and certified. It has lower dielectric loss and can maintain better performance at higher speeds of transmission. Electronic materials, as the core foundation of information technology, new energy, artificial intelligence and other fields, are accelerating their development towards high performance, multifunctional integration, low power consumption and green sustainability.